Broadcom Reaches Shipment Milestone of One Million Lines

Service providers are expanding DSL and fiber connectivity with Broadcom solutions. Today, Broadcom announces that its Central Office (CO) chipsets BCM65200 and BCM65400 as well as Consumer Premise (CPE) chipset BCM63138 have shipped in more than one million lines to date.  Echoing the success of the industry’s standardization and ongoing enhancements to technology, both of these chipsets are utilized in systems now being certified via the Broadband Forum’s (BBF) test program at the University of New Hampshire InterOperability Laboratory (UNH-IOL). Broadcom is a key contributor to the BBF IR-337 certification test specification, as well as an active participant in supporting the interoperability events that led to the certifications announced today by the BBF.

Broadcom’s solutions offer the full range of capabilities critical to the ongoing success of, including high-density vectoring, support for the new 212MHz profile, media support for both coaxial and twisted-pair environments, and the unique ability to fall back to legacy xDSL standards.

“We are very encouraged by the rapid progress of from standardization to volume deployments,” said Greg Fischer, senior vice president and general manager of the Broadband Carrier Access division. “Our strong commitment to support both volume production and the interoperability efforts today announced by the BBF should reinforce operators’ high confidence in making a cornerstone of their Gigabit broadband roadmaps.”

Broadcom solutions are ideal for a number of applications where DSL is required to extend service providers’ fiber network to the consumer. DSL system vendor partners and operators view Broadcom’s chip sets as powerful tools where a comprehensive, highly functional, and power-efficient solution is needed. It’s these attributes that make solutions from Broadcom so successful and why this significant milestone was achieved today.

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